NCP5623B
PACKAGE DIMENSIONS
LLGA12
CASE 513AA ? 01
ISSUE O
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
0.10 C
D
TOP VIEW
A
B
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM
MIN MAX
0.50 0.60
A
0.00 0.05
A1
0.15 0.25
b
2.00 BSC
D
0.80 1.00
D2
2.00 BSC
E
0.55 0.65
E2
0.40 BSC
e
0.25 ???
K
0.30 0.50
L
0.40 0.60
L1
A
12X
0.08 C
SEATING
PLANE
A1
SIDE VIEW
C
D2
11X
L
L1
2
6
e
9X
0.66
SOLDERING FOOTPRINT*
2.30
1
12X
0.23
e/2
K
1
12
E2
2.06
0.93
0.40
PITCH
0.91
11
BOTTOM VIEW
7
12X
b
0.10 C A B
0.05 C NOTE 3
11X
0.56
0.63
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP5623B/D
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